Description
Product Description
Features:
- Intel? Socket LGA 1700?Support 13th and 12th Gen Series Processors
- Unparalleled Performance?Hybrid 6+2+1 Phases Digital VRM Solution
- Dual Channel DDR5?4*DIMMs XMP Memory Module Support
- Next Generation Storage?2*PCIe 4.0 x4 M.2 Connectors
- M.2 Thermal Guard?To Ensure M.2 SSD Performance
- EZ-Latch?PCIe 4.0×16 Slot with Quick Release Design
- Fast Networks?2.5GbE LAN
- Extended Connectivity?Rear USB-C? 10Gb/s DP HDMI
- Smart Fan 6?Features Multiple Temperature Sensors Hybrid Fan Headers with FAN STOP
- Q-Flash Plus?Update BIOS Without Installing the CPU Memory and Graphics Card
Specification:
Model | B760M DS3H |
CPU |
|
Chipset | Intel? B760 Express Chipset |
Memory |
|
Onboard Graphics |
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Audio |
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LAN | Realtek? 2.5GbE LAN chip (2.5 Gbps/1 Gbps/100 Mbps) |
Expansion Slots |
CPU: 1 x PCI Express x16 slot supporting PCIe 4.0 and running at x16 Chipset: 2 x PCI Express x1 slots supporting PCIe 3.0 and running at x1 |
Storage Interface |
CPU: 1 x M.2 connector (Socket 3 M key type 2280 PCIe 4.0 x4/x2 SSD support) (M2A_CPU) Chipset: 1 x M.2 connector (Socket 3 M key type 2280 PCIe 4.0 x4/x2 SSD support) (M2P_SB) RAID 0 RAID 1 RAID 5 and RAID 10 support for SATA storage devices |
USB |
Chipset: 1 x USB Type-C? port on the back panel with USB 3.2 Gen 2 support Chipset+2 USB 2.0 Hubs: 4 x USB 2.0/1.1 ports available through the internal USB headers |
Internal I/O Connectors |
|
Back Panel Connectors |
|
I/O Controller | iTE? I/O Controller Chip |
H/W Monitoring |
|
BIOS |
|
Unique Features |
|
Bundled Software |
|
Operating System |
|
Form Factor | Micro ATX Form Factor; 24.4cm x 24.4cm |
Warranty | 3 Years |
Note | *** Features Price Specifications are subject to change without notice. |
Item specifics
-
PLATFORM
INTEL -
SOCKET
LGA1700 -
Chipset
B760 -
SUPPORTED MEMORY TYPE
DDR5 -
MAX MEMORY SUPPORT
192 GB -
FORM FACTOR
M-ATX